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The AKT-PiVot PVD system is designed to deposit critical pixel transistor and interconnect layers on 5.7m2 glass sheets for flat panel display manufacturing. The superior performance of the AKT-PiVot helps display manufacturers produce faster transistors for ultra-high resolution (UHD) displays with rapid refresh rates.

The AKT-PiVot system’s modular architecture delivers significantly faster cycle time and enables a large variety of configurations to maximize production efficiency. Unlike traditional in-line systems, the AKT-PiVot’s parallel processing capability eliminates bottlenecks caused by different process times for each film layer. The system’s cluster-like arrangement also allows continuous operation during individual module maintenance.

Proprietary rotary cathode technology enables nearly 3x higher target utilization than any competitive system. Each deposition module of the PiVot system features an array of large-volume, rotary targets that have >4x longer lifetime than conventional planar targets. The PiVot system’s deposition modules feature an innovative pre-sputter unit that enables target conditioning using only one substrate, rather than up to 50 substrates that are needed with other systems to achieve the same results.

For metal oxide-based TFTs, the AKT-PiVot system deposits the critical transistor channel material, IGZO, with unprecedented uniformity and stability using Applied’s proprietary rotary cathode technology. The AKT-PiVot system is the only IGZO solution capable of overcoming the “mura effect” – a critical unmet challenge that has hindered metal oxide technology from mainstream acceptance for LCDs. In addition, the breakthrough stability of PiVot-deposited IGZO films offers the promise of using metal oxide backplanes for OLED displays, significantly lowering cost and helping to make large-area OLED televisions affordable.

Using the PiVot system, FPD manufacturers can transition from aluminum to copper interconnect bus lines to achieve faster pixel response and lower power consumption in next-generation LCD-TV panels. Key to the PiVot system’s superior film quality is its proprietary rotary cathode design that employs unique deposition modulation technology to deposit copper layers with uniform grain distribution, low resistivity and high thickness uniformity. The PiVot system also enables greater than 80% target utilization to provide significant savings in expensive target material.