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Next-Generation NAND

Expanding the storage capacity of NAND Flash memory is achieved by stacking multiple memory arrays on top of each other, thereby multiplying the capacity of the chip. The capacity can be further increased by reducing the size of each cell. Applied's innovative systems are helping Flash memory manufacturers scale this technology to 96 pairs and beyond.

As further scaling of conventional flash memory cells becomes impractical, many leading manufacturers are developing a technology called "3D Stacked NAND." Multiple 2D memory arrays are fabricated on top of each other, thereby multiplying the capacity of the chip without reducing the size of each cell. Applied's innovative systems are helping flash memory manufacturers implement this exciting new technology.

Memory manufacturers are developing methods of building 3D cell arrays with as many as 16 layers. While offering much greater memory density than traditional planar layouts, this design results in the need to fabricate very tall structures – which creates new manufacturing challenges.

Applied has developed breakthrough manufacturing technology to help its memory customers to implement these remarkable structures in high-volume manufacturing.

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