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Previous Issues

Previous Issues

On November 10, Applied Materials celebrated it’s 50th anniversary. Marking 50 years in business is an exciting milestone for us. We look back over the past five decades and clearly we see a world transformed.

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The semiconductor industry’s use of energy and other resources is increasing as wafer-processing grows more complex and as the industry expands production worldwide. In the face of rising costs and stringent government regulations, it is imperative to operate more efficiently.

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Semiconductor fabs are on an ever-tightening schedule to deliver the latest components for consumer-electronics buying cycles. Product lifecycles are shorter and the business risk of being late is greater for each new cycle, so it is more important than ever for all of a fab’s resources to be in place and ready to go when needed.

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The era of smart manufacturing, Industry 4.0 and the smart factory promises significant opportunities to reduce cost, boost productivity and improve quality in microelectronics manufacturing. But it also presents the industry with new, unique challenges.

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The wireless landscape is becoming far more sophisticated as Bluetooth Low Energy (BLE) and mesh networks such as Zigbee and Thread take hold. When Silicon Valley tech entrepreneur Lucio Lanza was asked what the Next Big Thing is likely to be for the semiconductor industry, he gave exactly the right answer: "connectivity."

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With a successful initial public offering (IPO) now behind it, X-FAB Silicon Foundries is readying a capacity expansion drive for increased MEMS and analog/mixed-signal IC production across the six fabs it operates.

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When you put on a virtual reality (VR) headset you are transported to another world, a place where reality is just a whim of the imagination. What’s far from imaginary, though, is the impact VR is having on all of us, whether we personally use VR headsets or not.

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While the MEMS market has matured in recent years, there’s still a lot of healthy growth ahead as new device technologies come to market and segment stalwarts (IMUs, RF MEMS, etc.) see device volumes rise with further adoption in end-user applications.

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When I set out this spring to interview several Applied Materials engineers for a Nanochip Express article about the company’s annual Engineering Technology (ET) conferences, I didn’t realize I would learn so much about how engineers think—and relate.
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隨著器件變得更小,封裝更密集,集成電路日益復雜,缺陷降低也變得更難,但仍然是芯片制造商保持競爭力的關鍵。晶圓代工廠、存儲器件和邏輯器件制造廠需要一套方法、多樣化的技能和專業化的工具來有效降低缺陷水平,同時最大程度減少對生產的干擾。應用材料公司 FabVantage™ 咨詢團隊推出了全新的缺陷降低服務,提供專業化的方法、工藝專業知識、數據分析技術和診斷儀器來簡化根本原因的識別過程。

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