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nanochip fab solutions

Nanochip Cover
2016 年冬

隨著摩爾定律在實踐和物理上的局限被逐漸突破,一些晶圓制造商正在規劃新的藍圖以實現“后摩爾定律”(More Moore) 先進 CMOS 技術或“超越摩爾定律”(More than Moore) 非數字功能。無論貴公司採用哪種規劃,本期 Nanochip 聚焦專刊都將提供解決方案,以更好地滿足貴公司所需。更多自動化工具。更多工藝改進。更高產能和成品率。更大利潤。

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Previous Issues

Previous Issues

Ion implant tools are essential for semiconductor manufacturing because dopants such as arsenic, boron and phosphorous must be implanted into silicon to fabricate transistor structures such as gates and wells.

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I sometimes divide information into “heads down,” which describes new design and manufacturing tools, for example, and “heads up,” which includes changes in the worldwide economy, consumer spending trends, and other “big picture” data.

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The ITRS semiconductor roadmap has morphed into the International Roadmap for Devices and Systems (IRDS), with a different, more system - and application-focused purpose than the scaling-oriented ITRS.

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Chemical mechanical planarization/polishing (CMP) processing is affected by various factors, including consumables, process parameters, and polisher hardware design.

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Fully automated fabs offer significantly better yields, output, cycle times, operating costs and flexibility than partially automated ones.

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When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.

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Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.

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Applied has developed a new output improvement service solution for the 200mm Endura system to quickly modernize the equipment, improve process control and increase output by an average of 10%.

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There was a period, one that ended five or more years ago, when the semiconductor equipment industry put nearly all of its attention into improving 300mm manufacturing. Then smartphone sales exploded.

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為了提高制造流程的可持 續性,許多制造商採用工廠自 動化這一關鍵策略,因為該策 略可減少污染、庫存、不必要 的加工環節和設備空載時間。 SanDisk 上海封裝及測試工廠的 試點項目展示了這一方法的良 好前景。

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