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Ion implant tools are essential for semiconductor manufacturing because dopants such as arsenic, boron and phosphorous must be implanted into silicon to fabricate transistor structures such as gates and wells.
When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.
Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.
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