The Single-Wafer High Current Solution
The VIISta HC is designed to deliver the highest productivity for single-wafer high current processes. It is the only system capable of interlocked angle control for beam-steering repeatability, and uses a patented dual-magnet ribbon beam architecture for low particle performance. Only single-wafer systems like the VIISta HC provide low particle processing at high productivity levels, small lot flexibility and wafer-level control.
The Sub 90nm Challenge
For sub 90nm devices, implant processes must be free of ballistic, device-killer particles that occur in traditional batch high current ion implanters. At the same time, device scaling continues to drive shallower source drain (SD), source drain extension (SDE) and poly gate doping requirements that lead to lower productivity of conductive implants. Abrupt SDE junction formation requires precise angle control and tilt capability to ensure consistent device Ion/Ioff characteristics. The VIISta HC is designed as the most productive single-wafer high current implanter for sub 90nm device requirements.
Highest Productivity
The VIISta HC builds on Varian Semiconductor’s patented dual-magnet ribbon beam architecture for enhanced low energy performance. The beamline transmission and on-wafer beam utilization has been increased to further ensure the highest productivity for high current driver applications. The VIISta HC features a unique decel mode configuration for increased throughput. High throughput coupled with single-wafer contamination control provides the highest single-wafer high current productivity for advanced 300mm applications. The VIISta HC is able to maintain high productivity while simultaneously providing the required dose, energy, beam steering, and low contamination levels required in sub-90nm processing.
Precise Beam Steering
The VIISta high current family is the only single-wafer high current ion implantation system capable of meeting the requirements for true-zero applications. The unique closed-loop Varian Positioning System (VPS) delivers accurate, repeatable, and interlocked incident angle control for true-zero degree and precise-tilted angle implants.
Ribbon Beam for Superior Process Results
The patented dual-magnet ribbon beam architecture of the VIISta HC implants the entire width of the wafer and allows for a simple one-dimensional wafer scan. Compared to single-magnet systems, the ribbon beam approach uses a second magnet that isolates sources of particles. The result is lower contamination levels on the wafer.