Raider-S ECD

The Raider-S is a high-volume single-wafer electroplating tool for TSV and WLP applications.  It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems.

Features

• Advanced metal deposition or clean chambers
• 15 to over 27 process chambers
• Incorporated chemical analysis options
• Membrane plating technology
• Multi-zone anode for thinned seed plating
• Small foot print
• 200, or 300mm wafer sizes

Applications ECD

• Electrolytic metal deposition (Cu-TSV, Pillar, and SnAg bumping)