Producer BLOk PECVD

The Applied Producer BLOk (Barrier Low k) PECVD (Plasma-Enhanced Chemical Vapor Deposition) system provides the industry's leading ultra low k copper barrier and etch stop films for damascene interconnect applications. With the Producer's innovative Twin Chamber architecture, each wafer undergoes a patented in-situ copper oxide removal process prior to BLOk deposition, ensuring excellent adhesion to copper and superior electromigration performance.

BLOk films enable significant reductions in the capacitance of the dielectric film stack, while maintaining excellent etch selectivity and electrical performance, for continued RC scaling. Proven surface preparation and initiation layer processes enable BLOk II to be readily integrated with Black Diamond and BD II films, ensuring a smooth generational transition for 45nm and beyond devices.

The Applied BLOk processes run on the production-proven, high-throughput Producer platform. Up to six wafers can be processed simultaneously for superior productivity and significant reduction in cost of ownership with high system reliability. Platform extendibility enables customers to leverage the Producer toolset for multiple process nodes.

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