Endura iFill Al CVD/PVD

The Applied Endura iFill Al CVD/PVD (Chemical Vapor Deposition/Physical Vapor Deposition) system extends aluminum fill technology to sub-70nm DRAM and Flash memory applications. The system combines Applied's innovative CVD Al seed technology with the production-proven PVD Al fill process on the high-productivity Endura platform to deliver void-free, low-resistivity via fill of high aspect ratio structures at low thermal budget for improved yield and device reliability.

The CVD Al technology delivers a highly-conformal seed layer with >60% sidewall and bottom coverage, enabling chip manufacturers to replace higher resistance tungsten plugs with aluminum for faster chips. For the aluminum fill process step, the Al HP PVD chamber offers extended process kit life and significant reduction in preventative maintenance time compared to standard PVD Al while maintaining process transparency.

By integrating clean, Ti wetting/barrier layer, Al fill, and anti-reflective coating on a single system, the Endura iFill system delivers a significant lower cost of ownership compared to conventional tungsten/aluminum slab schemes.

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