Semiconductor Technologies

Applied Materials is the largest supplier of manufacturing equipment, services and automation software to the semiconductor industry – a position that the company has held since 1992. Our people and innovative products can be found in every semiconductor factory in the world, enabling the production of every advanced microchip.

As the industry moves from one technology generation to the next in its drive to make smaller, faster and more functional chips, Applied is always there – providing the leading-edge technology to help make it happen.

A complete listing of Applied's semiconductor manufacturing equipment, organized by category, is provided below.

Atomic Layer Deposition (ALD)
Applied’s ALD solutions deposit materials on the wafer one fraction of a monolayer at a time to create ultra-thin layers in advanced transistor, memory and interconnect applications.
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Chemical-Mechanical Planarization (CMP)
Applied’s CMP systems use a combination of physical abrasion and chemical erosion to remove material from the surface of a wafer so that subsequent processing can begin from a flat surface.
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Conformal Plasma Doping (CPD)
Applied's CPD technology enables gentle, uniform doping over complex 3D chip structures.
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Dielectric Deposition
Applied’s dielectric deposition systems use chemical vapor deposition (CVD) technology to deposit insulating materials onto semiconductor wafers.
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Etch
Applied’s plasma etch systems are used to selectively remove material from the surface of a wafer in areas that have been defined by the lithography process.
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Inspection
Applied’s inspection systems are used to detect particles and process-induced defects that can occur on wafers or photomasks during fabrication.
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Mask
Applied offers systems for the fabrication and inspection of advanced photomasks used by a lithography system to define circuit patterns on the wafer.
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Metallization
Applied’s metallization systems deposit conductive metal and metal alloys to create circuit features such as interconnects, transistor contacts and through-silicon vias (TSVs).
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Metrology
Applied’s metrology systems are used to measure the physical dimensions of circuit features to determine if they meet specifications.
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Surface Preparation and Cleaning
Applied offers highly-flexible surface preparation systems that are used to clean and remove residues from the surface of the wafer. This process is critical to the quality of films that are subsequently deposited in the chip fabrication process.
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Thermal Processes
Applied’s thermal processing systems are used to elevate the temperature of the wafer and drive chemical reactions that will modify the properties of deposited films.
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