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Previous Issues

Previous Issues

While the MEMS market has matured in recent years, there’s still a lot of healthy growth ahead as new device technologies come to market and segment stalwarts (IMUs, RF MEMS, etc.) see device volumes rise with further adoption in end-user applications.

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When I set out this spring to interview several Applied Materials engineers for a Nanochip Express article about the company’s annual Engineering Technology (ET) conferences, I didn’t realize I would learn so much about how engineers think—and relate.
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随着器件变得更小,封装更密集,集成电路日益复杂,缺陷降低也变得更难,但仍然是芯片制造商保持竞争力的关键。晶圆代工厂、存储器件和逻辑器件制造厂需要一套方法、多样化的技能和专业化的工具来有效降低缺陷水平,同时最大程度减少对生产的干扰。应用材料公司 FabVantage™ 咨询团队推出了全新的缺陷降低服务,提供专业化的方法、工艺专业知识、数据分析技术和诊断仪器来简化根本原因的识别过程。

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预计在未来几年推行的 5G 无线标准,将对终端用户设备的集成电路数量和类型以及传输更高频信号所需的基站和中继器产生重大影响。
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如今,新建一家晶圆制造厂的成本可能高达 100 亿美元,如此高昂的资本支出使得快速实现投资回报变得更为重要。应用材料公司 FabVantage™ 咨询部现在推出了全新的晶圆制造厂早期阶段规划服务,能帮助客户更快更高效地创办晶圆厂。

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随着晶圆加工越来越复杂,加上行业在全球范围内的生产扩张,半导体行业对能源和其他资源的用量在增加。面对不断上涨的成本和严格的政府监管,高效运行势在必行。

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当今的半导体行业日新月异,制造商要迅速应对,刻不容缓

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过去十年来,随着数据流开始成倍激增,“大数据”一词变得司空见惯,人们不免担心如此大量的原始数据如何能转化为有用信息。

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离子注入设备对半导体制造厂商必不可少,因为制造栅极和阱等晶体管结构时必须向硅 中注入砷、硼和磷等掺杂剂。无论客户是生产最先进的 300 毫米数字逻辑和存储电路, 是利用 200 毫米工艺构建模拟、功率和其他产品,还是制造 CMOS 图像传感器,都需要 离子注入设备。

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I sometimes divide information into “heads down,” which describes new design and manufacturing tools, for example, and “heads up,” which includes changes in the worldwide economy, consumer spending trends, and other “big picture” data.

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