TSV Fabrication

Fabricating devices using TSVs requires an unprecedented level of cooperation between companies up and down the value chain. Applied has the capability to validate complete TSV process flows at its Maydan Technology Center, and is collaborating with other key suppliers and multiple consortia to fine-tune the technology. Applied's strategy is to offer chip manufacturers a cost-effective, integrated path to implementing their most challenging 3D packaging schemes so they can quickly bring their exciting new products to market.

• Centura Silvia Etch
• Producer Avila PECVD
• Producer Invia CVD
• Producer Optiva CVD
• Raider-S ECD
• Reflexion GT CMP Platform