Wafer Manufacturing

Applied Materials’ HCT wafering systems slice both mono-crystalline and multi-crystalline silicon ingots into thin wafers. These systems combine the industry’s highest productivity with best-in-class yield to achieve the lowest total cost and are optimized to handle thin wire and advanced wire technologies.

The Applied HCT Squarer slices mono-crystalline silicon ingots and multi-crystalline silicon castings into bricks, ready for wafer slicing.

The Applied HCT Cropper crops the tops and tails from mono and multi crystalline silicon ingots, in preparation for the squaring process.