Why Does Wafer Level Packaging Matter?
More and more consumers want to have the world at their fingertips—literally—anytime, anywhere. Smart phones, e-book readers, multi-media tablets, and laptop computers are examples. Wafer-level packaging enables rich graphics, high speed and low-power functionality in these mobile electronic end products. As these consumer products are becoming more mobility-enabled and multi-functional, they are also getting smaller and smaller. And users also expect these devices to have a longer battery life. Wafer-level packaging will enable sustained evolution of these mobile devices. Advanced packaging will also be a key to breaking through what has been called the “memory wall” or the limitation on processor performance that results from slower communication to the supporting memory chips. Advanced packaging makes the processor memory sub-system operate faster and more efficiently.
What role does Applied Materials play?
Applied Materials is the industry leader in wafer-level packaging, whose systems enable our customers to implement any of the above packaging techniques, from bumping to RDL to TSV. In addition to enabling the bump and RDL roadmap for technology and cost, we have spear-headed the industry’s development of TSV technology. Because of our work in this area, we are in a strong position to serve our customers as they begin to adopt this technology. We have designed new products and refined existing systems to address specific requirements for almost all of the steps in TSV fabrication.
TSV Fabrication Products
Applied offers integration expertise and an extensive range of systems to enable widespread adoption of this important new chip packaging technology.
Bump/RDL Technology Products
Applied offers products targeted to the unique needs of conventional packaging, with high reliability, low cost-of-ownership, and rapid process capability.