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Patterning
VeritySEM4i Metrology
Designed for sub-32nm metrology, the Applied Materials CD-SEM system - VeritySEM4i, delivers high SEM resolution on the order of 1.5nm, high detection efficiency, powerful image processing and metrology algorithms and extremely accurate navigation. The system offers industry-leading Fleet Matching and Precision down to 0.3nm.
With innovative SEM column and algorithm designs, VeritySEM4i ensures minimal ArF resist shrinkage, accurate high aspect ratio contact / via measurement, proven Self-Aligned Double Patterning (SADP) capability, and robust handling of charged wafers.
VeritySEM4i delivers high throughput and uptime, advanced automation and within-Å-level matching accuracy, virtually eliminating the need for tool operators and reducing the number of CD-SEM tools required per fab. The overall results are higher productivity, lower cost of ownership, and reduced CD-SEM capital investment.
VeritySEM4i enables SADP metrology, which is difficult due to the small feature fidelity of the patterns, making both measurement and navigation challenging. Through high SEM resolution, accurate navigation and a unique Core vs. Gap algorithm, this advanced algorithm is capable of automatically distinguishing between two types of spaces and provides full process control for SADP.
The Offline Recipe Generator (ORG) features recipe editing capabilities via an external server, enabling multiple users to create recipes from CAD offline without the need for wafers. The recipes are automatically stored in the tool database. By eliminating recipe creation time loss, the ORG enables the user to maximize the tool's utilization in production.
VeritySEM4i's OPC|CheckMax is a proven solution for automating the Optical Proximity Correction (OPC) mask qualification process. As chipmakers advance below 32nm, OPC-enhanced features are commonly incorporated into mask designs for all layers. Hundreds of CD measurements are required to verify that the features printed on the wafer are indeed what the device designers intended to produce. With a suite of proprietary algorithms, OPC|CheckMax receives input from EDA design systems, automatically creates CD-SEM measurement recipes, and then directs VeritySEM4i to measure thousands of sites at high throughput without operator assistance.
An advanced Edge Contour Extraction (ECE) algorithm is now available, significantly improving OPC modeling predictability. This enhanced capability is based on precise SEM-based feature contour extraction overlaid accurately on the design intent. This feed to the EDA tool allows multiple 2D measurements for each feature set.
