Semiconductor

Vantage RadOx RTP

Key Features

  • Proprietary radical-based oxidation process
  • Tight thermal budget control and in-process monitoring
  • Extendible, reduced-pressure capability for advanced device thermal processing
  • High productivity, small footprint Vantage platform with plug-and-play install design

Advanced device scaling requires thinner, higher quality oxides with low leakage and high reliability, reduced thermal budgets, and tighter process control. With its radical oxidation chemistry, The Applied Vantage RadOx RTP grows a high density, high quality oxide in low thermal budgets. Its innovative technology breaks through the scaling barriers for critical oxidation steps like memory gate oxide, STI liner oxide, sacrificial oxide, sidewall oxide, flash tunnel oxide, and ONO stack. RadOx offers superior quality oxide on the industry-leading Radiance chamber and the production-proven Vantage platform.

Applications: All oxidation steps including Flash tunnel oxide, ONO stack, STI liner oxide, memory gate oxide, sacrificial oxide, and sidewall (re)oxide.

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