UVision 4 Inspection

The UVision 4 system serves the full range of front-end-of-line and lithography to back-end-of-line applications in wafer inspection.  The UVision 4 system combines enhanced sensitivity and productivity with ease of use in a powerful, versatile solution for the most advanced patterning challenges of 32nm and below with optical inspection capabilities beyond the resolution limits of conventional brightfield (BF) inspection.

Enhanced light intensity, optimized scattered light collection [i.e., greyfield (GF)] together with a small GF pixel size and suite of noise reduction capabilities raise performance to a new level. These sensitivity enhancements enable the UVision 4 to detect ultra-small defects of sizes.

For example finding and identifying a 45nm defect on a patterned wafer using the UVision 4 is like spotting an ant on a Manhattan street from a missile flying overhead at Mach 20 – and then telling you its species. In reality, 20,000 defects would fit on top of a red blood cell.

View more Inspection tools and other semiconductor technologies.