Spectrum SP

Automated batch wafer chemical system for high volume manufacturing. Features spray processing, high throughput, flexible process formats, closed-loop machine and process control, and small footprint, providing surface preparation solutions spanning FEOL to BEOL, as well as wafer scale packaging.

How Does It Work

• Efficient on-axis spray; active chemical delivery at reaction temperature across the wafers
• Optimized chemical nozzle array for uniform coverage of the product's surface
• On-board chemical mixing and storage
• High productivity automation within an enclosed mini-environment

Modules

• Spin Rinser/Dryer chamber provides DI clean and dry. DI water is sprayed onto the wafers as they rotate about their central axis. After rinsing to final resistivity, they are spin-dried with heated N2. This module supplements the spray acid or solvent modules for enhanced throughput.
• Spray Acid Module can be equipped with a Chemical Process Chamber (CPC) and a Spin Rinse/Dry (SRD) chamber, or with two CPCs. This module features patented PTFE process chamber and fluoropolymer plumbing and valves, accurate on-board chemical mixing, in-line quartz IR heaters for non-HF chemistries, in-tank heater exchanger for HF-based chemistries, and chemical concentration monitoring and control.
• Spray Solvent Module can be configured with a CPC, an SRD, or two CPCs. The solvent module features an electropolished stainless steel process chamber, fresh and reclaim chemical solvent capability, solvent and water rinse capability, and an in-line stainless steel heating.
• End-Effector Rinse/Dry (EERD) station cleans and dries the robot wafer handler. A DI water clean, followed by a N2 dry, eliminates cross-contamination and ensures a dry end-effector for transferring dry wafers. The EERD resides below the process chemical station, eliminating the need to occupy additional floor space.
• Surface-tension gradient-dry capability is available with a Spectrum E
• Immersion Module features standard and advanced technology immersion capability, typically including a chemical cell for corrosive or caustic media, an overflow (or quick dump rinse) module, and surface tension gradient dryer. The immersion module offers numerous features, including recirculation, filtration and megasonics.

What It Can Do For You

• Increase productivity with optimized process module configurations: one or two modules for productivity and flexibility
• Offer an ISO Class 2 mini-environment, 4-axis linear track robot, dynamic control to maintain optimum conditions and provide a clean and repeatable environment for high yield processing.
• Deliver versatility in terms of configuration, applications, and wafer size handling
• Provides FEOL to BEOL common manufacturing platforms as will as wafer scale packaging
• Saves costs with low facilities and process media consumption; high productivity (wph/sq.ft.)