Producer Invia CVD

The Producer InVia system delivers an innovative CVD process that can provide highly conformal and electrically robust dielectric liners for fabricating via-first and via-middle through-silicon vias (TSVs).  For customers diversifying to TSV processing, the InVia system offers not only a benchmark process but demonstrated integration worthiness in the TSV manufacturing sequence.

It is the only process that satisfies the thermal budget and conformality requirements for via-middle TSV. The unique deposition process results in film breakdown voltage and leakage current that are significant improvements over the standard specifications.

The InVia system is also uniquely capable of depositing liners as thin as 200nm and as thick as 1µm over a wide range of aspect ratios (6:1 to 11:1).

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