Producer Celera PECVD

The Applied Producer Celera PECVD (Plasma-Enhanced Chemical Vapor Deposition) system provides tunable compressive and tensile high-stress silicon nitride films for strain engineering solutions at ≤45nm technology nodes.

The Producer Celera system is the first to offer an integrated stress nitride deposition and UV cure solution which delivers tensile stress of up to 1.7GPa, with extendibility to 2.0GPa, while meeting low thermal budget requirements. The same deposition chamber can deposit films with compressive stresses up to 3.5 GPa. The process utilizes production-proven silane CVD technology to deliver superior step coverage (<70%) while retaining excellent SiN etch-stop properties and pattern loading results.

The Applied Celera deposition and UV cure processes are integrated on the production-proven, high-throughput Producer platform. With its flexible Twin Chamber configuration, the Producer platform enables integrated multi-step deposition and UV cure process capability for improved transistor performance and reliability. Both tensile and compressive stress films can be deposited in the same Twin Chamber for process flexibility, and platform extendibility enables customers to leverage the Producer toolset for multiple process nodes.

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