Endura Underbump Metallization (UBM) PVD

Extending world-class PVD (Physical Vapor Deposition) interconnect technology to back-end packaging, Applied Materials provides proven PVD solutions for underbump metallization (UBM) and bondpad packaging schemes. These solutions leverage Applied Materials' PVD expertise in advanced interconnect structures and world-class electrostatic chuck (ESC) and preclean technologies to deliver thin films with excellent uniformity over a broad range of film thicknesses (<1,000Å to >1µm).

Advanced ESC technology enables active wafer temperature control and stress modulation for successful integration between interconnect metals and solder bumps with low cost of ownership and minimal die loss. In-situ removal of organic residues and native oxide using the Preclean XT ensures a clean surface resulting in low contact resistance and excellent adhesion.

Applied Materials brings extensive PVD experience to advanced back-end packaging with product offerings that include NiV, Cu, Ti, TiW, CuCr, TaN, and the Al HP PVD chamber.

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