Centura Ultima HDP-CVD

With over 1,000 Ultima systems in production world-wide, the Applied Centura Ultima X HDP‑CVD (High-Density Plasma Chemical Vapor Deposition) is the industry-leading multi-generational workhorse delivering proven, void-free gap fill solutions for advanced Memory and Logic applications.

Applied Materials' patented Ultima X HDP-CVD reactor design and process technology deposits both undoped (USG) and doped (PSG and FSG) films for a wide range of applications including shallow-trench isolation (STI), pre-metal dielectric (PMD), inter-level dielectric (ILD) inter-metal dielectric (IMD), and passivation.

Ultima X is integrated on the state-of-the-art Centura 300mm mainframe for increased serviceability and throughput, without sacrificing footprint.

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