Centura Mariana Trench Etch

The Applied Centura Mariana Trench Etch system can etch 80:1 aspect ratio trenches—a critical capability which enables chipmakers to scale DRAM capacitors beyond 70nm. Dual-frequency tuning capabilities tightly control the etch profile and CD (critical dimension) with 2% etch depth non-uniformity, while the system's specialized plasma chemistry achieves unprecedented mask selectivity.

Its closed-loop temperature control maximizes mean wafers between cleans. Simplified design streamlines maintenance and facilitates the industry's shortest mean time to clean and recover. The dual-zone, ceramic electrostatic chuck and advanced chamber materials aid stringent defect control and lower consumables costs.

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