Centura Enabler E5 Etch

The Applied Centura Enabler E5 dielectric etch system is the industry's most advanced solution for creating the 40:1 high aspect ratio contact features that are critical to the yield and performance of 32nm and below DRAM and Flash memory chips. The Enabler E5 sets a new benchmark in profile control, enabling customers to manufacture high performance, robust, next-generation memory devices with >80% bottom-to-top CD ratios across the wafer, and with less than 3nm bowing of the contact sidewall.

Next-generation Flash and DRAM devices pose a significant challenge for dielectric etch systems since it is very difficult to achieve the global profile control necessary for fabricating high aspect ratio contacts. The Enabler E5 is the only system that can meet all these requirements, allowing memory manufacturers to continue to increase density and reduce the cost-per-bit.

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