The Applied HCT cropper crops the tops and tails of mono- and multi-crystalline silicon ingots, in preparation for the squaring process.
The system has a production capacity of 80MW per year and delivers very low kerf loss (0.30-0.35µm).
Applied HCT Wafering Systems Brochure English (1.3MB) 中文 (1.6MB)
Wafer Slicing Technology Primer English (656kB) 中文 (484kB)
Advanced Wire Sawing Technology Whitepaper English (769kB) 中文 (1.0MB)
Wire Sawing Economics and COO Whitepaper English (714kB) 中文 (1.1MB)