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Crystalline Silicon
Applied HCT B5
The Applied HCT B5 wafering system slices both mono-crystalline and multi-crystalline silicon ingots into thin wafers. The B5 is the current market leader with over a 1000 systems in production at customer sites around the world.
With double the load potential of conventional competing systems and a unique four position architecture for flexible loading, the B5 gives users a wider process window to tune load size and table speed for highest productivity with best-in-class yield and as a result lowest wafer cost.
Flexible load size, reduced footprint, minimal downtime for wire and slurry change, minimal wire breakage and greater process reproducibility all make the B5 ideally suited for volume manufacturing where high availability is key.
The Structured Wire Advantage
The Applied HCT B5’s class-leading productivity can be improved even further using Applied’s proprietary structured wire technology. Structured wire transports slurry more efficiently, enabling higher table speeds, which reduces wire consumption by 20% wire consumption saving and raises productivity by over 20%. These benefits deliver an incremental 2¢ per wafer total cost of ownership reduction over an HCT B5 system using standard wire, and a 5¢ per wafer reduction over conventional 1m load systems.
Features and Benefits
- Double the maximum load potential of conventional systems and flexible load size
- Designed for high availability with lower cost of ownership
- Proven thin wire capability down to 120μm and below
- Robust platform extendable to advanced wire technologies
- Slices both mono-crystalline and multi-crystalline silicon ingots
| HCT B5 with structured wire | HCT B5 with standard wire | |
| Yield | 98% | 98% |
| Productivity increase | >30% | >15% |
| System downtime reduction | 30% | 30% |
| Energy savings | 20% | 8% |
| Cost/wafer savings | 5¢ | 3¢ |
| Cash flow/system | 30% | >20% |
Baseline: conventional 1m load system with 120µm wire diameter, 180µm wafer thickness.
