Applied HCT B5

The Applied HCT B5 wafering system slices both mono-crystalline and multi-crystalline silicon ingots into thin wafers. The B5 is the current market leader with over a 1000 systems in production at customer sites around the world.

With double the load potential of conventional competing systems and a unique four position architecture for flexible loading, the B5 gives users a wider process window to tune load size and table speed for highest productivity with best-in-class yield and as a result lowest wafer cost.

Flexible load size, reduced footprint, minimal downtime for wire and slurry change, minimal wire breakage and greater process reproducibility all make the B5 ideally suited for volume manufacturing where high availability is key.

The design of the B5 system is also optimized for thin wire performance with continuously adjustable wire tracking, controlled acceleration and deceleration algorithms and low inertia wire management.

Features and Benefits

• Double the maximum load potential of conventional systems and flexible load size
• 98% yield with >15% higher productivity*
• 30% lower system downtime*
• 3 cents lower cost / wafer*
• 20% greater cash flow / tool*
• Designed for high availability in volume manufacturing
• Proven thin wire capability down to 120μm and below
• Robust platform extendable to advanced wire technologies

(* - At 120µm wire size and 180µm wafer thickness, when compared to conventional 1m load systems)