E3 Run-to-Run Control (R2R)

The E3 Run-to-Run (R2R) Control module improves process consistency and product quality, increases yields and reduces scrap by optimizing recipe parameters from lot-to-lot or wafer-to-wafer using feedback from process models, incoming variations and metrology data. E3 R2R Control is proven to improve customers’ process capabilities and process capability index (CpK) on lithography, dry etch, chemical mechanical planarization (CMP) and diffusion by more than 25 percent.

• Makes automatic adjustments to processes to maintain a required target value for specific properties, such as wafer thickness and critical dimension
• Uses metrology data from each process step to adjust process recipes on a run-to-run basis
• Reduces model management activities through a unified modeling approach and advanced patented technology
• Enables customized strategies, such as rework, to be performed in a highly automated fashion
• Integrates seamlessly with E3 Statistical Process Control (SPC), E3 Fault Detection and Classification (FDC), E3 Equipment Performance Tracking (EPT) and E3 Advanced Data Mining (ADM)

Benefits

• Improve process capability and CpK
• Reduce process variability and scrapped wafers
• Decrease number of send-ahead wafers
• Lower cost of ownership

Email info_fs@amat.com for more product information.