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Olympia™

Continued process scaling is driving new levels of device performance. ALD is essential for a growing number of the device-critical process steps in 3D NAND and logic FinFET fabrication. However, while the conformality and uniform film thickness achieved with ALD is still vital for CD control, additional demands are being made on ALD to deliver a growing range of high-quality, robust films within restrictive thermal budgets of next-generation nodes.