The expanding use of MEMS devices, including accelerometers, gyroscopes and microphones, is a major contributor to the ongoing transformation of the mobile, automotive and medical device markets. Adoption is further accelerating with the development of multi-function or “combo” sensor packages smaller MEMS device footprint enables additional capability in a similar form-factor. New materials and device integration schemes are required to enable these combo devices. These include a need to deposit and etch thick epi to enable power reduction and…
In addition to thick Epi and deep reactive ion etch (DRIE), MEMS manufacturers are implementing novel materials like ultra-thick oxides (>20µm), AlN, piezo-electric materials (e.g. PZT) and low temperature CMOS compatible films such as SiGe. They are also moving to new packaging processes like through silicon vias (TSV) which facilitate device stacking.
With much of the growth from consumer devices, time to market and cost are increasing challenges for MEMS makers and increases the need for high productivity, high yield production tools. To support this, Applied is developing new 200mm capability on our production proven platforms for these and other technology challenges in the MEMS market.