CVD processes are used for a broad spectrum of applications. These range from patterning films to insulation materials in transistor structures and between the layers of conducting metal that form the electrical circuit.
Applications include shallow-trench isolation, pre-metal dielectric, inter-metal dielectric, and passivation. CVD processes are also important in strain engineering that uses compressive or tensile stress films to enhance transistor performance through improved conductivity. Applied’s diverse solutions meet critical demands for void-free gap fill in complex topography with demanding feature profiles, progressively lower-capacitance materials that help boost transistor speeds, and robustness to withstand additional process steps accompanying wafer-level packaging techniques being adopted for advanced mobile technologies.