Next Generation DRAM

Reflexion GT CMP Platform

As devices become more complex, incorporating a wider variety of materials and a growing number of film layers, demands on chemical-mechanical polishing (CMP) technology for enhanced removal uniformity, greater productivity, and lower costs continually expand. Future applications, such as 3D memory structures, will demand even greater removal control, while lower costs and higher productivity will be necessary if these new integration schemes are to be cost competitive.

The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes.

Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair.

For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.