Applied HCT MaxEdge
Introduced in March 2009, the Applied HCT MaxEdge system is leading the industry in its ability to cut both mono-crystalline and multi-crystalline silicon stock into ultra-thin wafers. Featuring a complete system re-design, the new MaxEdge system offers customers double the throughput of the competition, with the ability to cut wafers as thin as 120 µm in high-volume, day-to-day production.
The MaxEdge uses dual cutting wires, each of which cuts one half of the ingot, enabling larger loads with thinner wire. The MaxEdge delivers higher throughput than any other wire saw, dramatically reducing the number of machines required to meet a factory’s demand for wafering. In addition, fewer machines reduce operator and maintenance expenses, leading to lower cost of ownership. The new motorization enables a wider process window in terms of power and wire speed, delivering the flexibility to use thinner wire to slice thinner wafers without compromising productivity. The MaxEdge has been successfully tested slicing wafers as thin as 130 µm with wire as thin as 80 µm. 
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