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Applied Reflexion GT CMP Platform
The Applied Reflexion GT platform, the industry’s only available 300mm dual-wafer chemical-mechanical polishing (CMP) product, brings revolutionary technology, productivity, and cost-efficiency to advanced CMP, delivering the highest throughput density at the lowest cost per wafer. Targeted initially for copper to synchronize with the transition to copper memory, the new platform is extendible to other applications and future technology nodes.
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Leveraging Applied’s extensive experience in CMP and its industry-leading technology, the Reflexion GT platform’s unique architecture gives customers the best available on-wafer performance at up to twice the throughput of other CMP systems while saving on slurry consumption, extending pad life, and reducing the frequency of pad maintenance.
Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system’s advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied’s production-proven Desica technology with Marangoni vapor drying for fast, effective, watermark-free drying.
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An Introduction: Reflexion GT CMP
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