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Raider® ECD

The RAIDER ECD system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition delivers high throughput in a small footprint.

Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. A multi-zone anode array enables electroplating on ultra-thin and resistive seed layers. The system saves on costs by using ionic membranes to extend chemistry life and "no teach" precision automation to eliminate automation re-teach down-time.