Producer® Pyra™ Anneal
As CDs continue shrinking, the number of steps needed to pattern small structures is increasing, thus creating the need for multiple anneals. Some anneals modify patterning films to improve their etch selectivity to enable multi-patterning schemes. Others are used in metal reflow techniques that are becoming more essential for filling tiny, high aspect ratio features with larger-grained metal and without voids to help reduce line resistance—an especially challenging effect of decreasing interconnect dimensions.
The Applied Producer Pyra thermal processing system is the newest addition to the company’s suite of anneal products. This product targets the low to mid temperature range for applications mainly in the MOL/BEOL space. The high-productivity Pyra system was specifically designed for high-volume, soak anneals, leveraging the production-proven Producer platform with its low cost of operation and delivering uncompromised device performance.
Instead of lamps or lasers used on Applied’s spike and millisecond anneal systems, the Pyra system’s heating capability for soak anneals is based on a resistive heater that delivers excellent within-wafer and wafer-to-wafer anneal uniformity. The Producer platform with its multiple Twin Chamber® technology enables cycle time improvement in R&D mode and improved productivity in high-volume manufacturing mode.