Applied Materials, Inc. - Dielectric Deposition Press Releases

Dielectric Deposition Press Releases

Blanket Dielectrics

05/08/2008	Applied Materials Ships 200th Producer APF System, the CVD Patterning Technology of Choice for Advanced Device Scaling
08/13/2007	Applied Materials' Producer GT Wins Rapid Acceptance, Achieves 100th System Shipment Milestone
06/04/2007	Applied Materials Speeds Next-Generation Chips with Advanced BLOk II Low k Technology
05/15/2007	Applied Materials Releases Industry's Most Advanced Strain Engineering Technology to Boost 45nm Transistor Speed
11/14/2006	Applied Materials Releases the Industry's Most Productive CVD Processing Platform -- the Applied Producer GT
07/11/2006	Applied Materials' Black Diamond II Drives Advanced Low k Technology for 45nm Chips
07/10/2006	Applied Materials Extends Lithography-Enabling Solutions with New Advanced Patterning Film
11/09/2005	Applied Materials Wins 2005 "Best CVD Product" Award from TSMC
05/19/2004	Applied Materials Achieves Major CVD Milestone with 750 Applied Producer Systems Shipped
04/22/2004	Applied Materials' Black Diamond Low k Wins Best Product Award
03/25/2004	Chartered Selects Applied Materials' Advanced Transistor, Low k Interconnect and Inspection Technologies for 300mm Fab
02/04/2004	Chipmakers Break Low k Barrier, Take Leap Forward to Drive Next-Generation Electronics Using Applied Black Diamond
08/27/2003	Toshiba Utilizes Applied Materials Low k Films for 90nm Volume Production
05/08/2003	Applied Materials Dielectric Systems and Modules Win Supplier Excellence Award from Texas Instruments
04/30/2003	Applied Materials' 100th Producer 300mm CVD System Shipped to TSMC; Producer System Selected to Deposit Damascene Nitride Film for Copper Interconnects
04/14/2003	Applied Materials' Low k Films Selected by NEC for New 90nm Process Technology; Black Diamond and BLOk Low k Films Chosen for Manufacturability and Ease of Integration
02/25/2003	Applied Materials Enables Advanced Lithography with New DARC 193 Film
02/25/2003	Applied Materials Ships Milestone 500th Producer CVD System; High-Productivity Producer System Has Been Shipped to all Major Chip Manufacturers
02/24/2003	Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials' Systems Installed Worldwide To Build Copper Interconnects
06/25/2002	Applied Materials Introduces Advanced Patterning Film to Enable Sub-50nm Transistor Gates

Gap Fill Dielectrics

07/03/2006	Applied Materials' UVision Inspection System and Producer HARP CVD System Win Semiconductor International Awards
07/08/2004	Applied Materials Releases Breakthrough Gap-Fill Technology with Applied Producer HARP System
06/15/2004	Applied Materials Strengthens Leadership Position in HDP-CVD; Ships 100th 300mm System
05/19/2004	Applied Materials Achieves Major CVD Milestone with 750 Applied Producer Systems Shipped
07/18/2002	Applied Materials Named World's Number One Supplier of HDP-CVD Systems for the Fourth Consecutive Year