Dielectric Deposition is a process used to deposit a thin layer of insulating material onto the wafer using
Chemical Vapor Deposition (CVD) technology. Two dielectrics commonly used in semiconductor processing are silicon dioxide and silicon nitride. Advanced dielectrics include low dielectric constant (low k) films for copper interconnects, strain-inducing films to boost device performance, and patterning films and gap fill films to enable geometric scaling.

What's New in Thin Films† VLSI Research, January, 2006