Display Energy and Environment Fab Solutions Semiconductor Bright Future
Conductor Deposition Press Releases
Back
Aluminum Interconnect Solutions
12/06/2005 Applied Materials Announces Advanced CVD Aluminum Technology for Manufacturing Faster Flash and DRAM Chips
12/06/2005 Applied Materials Delivers Advanced Solutions for Flash Memory Chip Manufacturing
06/10/2003 Applied Materials Sets Industry Record with Shipment of 3,000th Endura PVD System
02/24/2003 Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials’ Systems Installed Worldwide To Build Copper Interconnects

Applied Endura2
02/17/2004 Applied Materials Sets New Benchmark for 300mm High-Volume Manufacturing with Applied Endura2 System

Contact Metallization - Sprint/iSprint
07/15/2003 Applied Materials Advances Sub-90nm Contacts with New ALD Tungsten Technology; iSprint ALD/CVD Centura System Brings Unmatched Capability for Current, Future Manufacturing

Contact Metallization Solutions - Liner/Barrier
7/10/2006 Applied Materials Delivers Key Technology for 45nm Contacts with Endura iLB II System
06/10/2003 Applied Materials Sets Industry Record with Shipment of 3,000th Endura PVD System
02/24/2003 Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials’ Systems Installed Worldwide To Build Copper Interconnects

Copper Interconnect Solutions - Copper Barrier/Seed
7/15/2008 Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System 
7/10/2006 New Aktiv Preclean Extends Applied Materials' PVD Barrier-Seed Technology Leadership in 45nm and Beyond
8/15/2005 Applied Materials Strengthens Leadership in 300mm Copper Barrier/Seed with 100th System Shipment
03/23/2004 Applied Materials Expands Leadership in Copper Barrier/Seed Technology with 250 Systems Shipped
06/10/2003 Applied Materials Sets Industry Record with Shipment of 3,000th Endura PVD System
02/24/2003 Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials’ Systems Installed Worldwide To Build Copper Interconnects

Device Packaging Metallization Solutions
06/10/2003 Applied Materials Sets Industry Record with Shipment of 3,000th Endura PVD System
02/24/2003 Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials’ Systems Installed Worldwide To Build Copper Interconnects

Front End Metallization Solutions
9/20/2006 Applied Materials Announces Breakthrough in Interface Engineering Technology for 65-45nm Transistors
05/17/2004 Applied Materials Advances Transistor Silicide Technology with Applied Endura ALPS Ni PVD
06/10/2003 Applied Materials Sets Industry Record with Shipment of 3,000th Endura PVD System
02/24/2003 Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials’ Systems Installed Worldwide To Build Copper Interconnects


Back