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		CMP Technical Articles/Papers CMP Overview of CMP Process Control Strategies, CMP-MIC, February 2006, pp 45-54 (440KB) Direct-Polish STI CMP Process for Next Generation Gap Fill Technologies, CMP-MIC, February 2006, pp 125-132 (89KB) Real-time Profile Control for Improved Copper CMP, Solid State Technology, June 2003 (212KB) The Development of a Direct-Polish Process for STI CMP, May 2003 (322KB) Hybrid CMP Process for Copper and Ultra Low-k Materials Integration, 2003 (65KB) Slurryless Fixed-Abrasive Web for Direct Polish STI CMPs, SEMICON Korea, 2003 (80KB) Ecmp Chemistry Is Key to ECMP Efficiency, Semiconductor International, 5/1/2007† Advanced Process Control Extends ECMP Process Consistency, Solid State Technology, February 2006† Smoothly Does It, European Semiconductor, March 2005† Breakthrough Technology for CMP, Semiconductor Fabtech 24th Edition (168KB) High Planarization Efficiency and Wide Process Window Using Electro Chemical Mechanical Planarization (Ecmp™), Mater. Res. Soc. Symp. Proc., Vol 867, 2005 (525KB) Ecmp: Novel Planarization Solution for 65nm and Below, ECS-ISTC, 2005 (83KB) Reproduced by permission of The ECS Asia, Inc. © The ECS Asia, Inc. International Semiconductor Technology Conference Proceeding “Semiconductor Technology” (ISTC 2005). All rights reserved. This work may not be reproduced, resold, distributed or modified without the express permission of The ECS Asia, Inc. View More † You will be leaving the Applied Materials Web site. The content of the third party Web site is not controlled by Applied Materials and this link is provided solely for your convenience.