Home About Careers Investors News Products Site Map

		CMP Press Releases 07/15/2008 Applied Materials' New eHARP System Extends Production-Proven STI Gap-Fill Technology to 32nm and Beyond  04/04/2008 Applied Materials Celebrates 2,500th CMP System Shipment, Reflecting Ten Years of CMP Technology Leadership 02/21/2006 Applied Materials Extends CMP Leadership with 500th 300mm System Shipment Applied Mirra CMP 12/05/2006 Applied Materials Introduces Major Advancement in CMP Polishing Pad Technology 02/02/2004 Applied Materials Ships Milestone 250th Copper CMP System to China's SMIC Foundry 12/22/2003 STMicroelectronics Achieves Exceptional Results on Applied Materials' Copper CMP System with Integrated Nova Metrology 02/24/2003 Applied Materials Leads the Industry in Delivering Copper Chip Technology; More Than 700 Applied Materials' Systems Installed Worldwide To Build Copper Interconnects Applied Reflexion CMP 11/29/2007 Applied Materials Takes CMP Process Control to 45nm and Beyond With FullVision Endpoint System 09/30/2003 Applied Materials Overcomes Critical Defect Roadblock with Integrated CMP Vapor Dry Technology 06/25/2003 Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds 04/14/2003 Applied Materials Awarded Key Patent for CMP Endpoint Detection Technology; Optical Endpoint Methodology Critical for Sub-130nm CMP Processing