The Applied Materials Charger UBM PVD system redefines productivity for the packaging industry, offering the highest-throughput, most reliable PVD system for under-bump metallization (UBM), redistribution layer, and CMOS image sensor applications. Leveraging Applied's long-standing experience in leading-edge PVD technology, the Charger system combines production-proven, high-reliability components and best known methods from other Applied systems with efficient, innovative Isani wafer treatment technology. The result is up time exceeding 85% and output almost double that of competing systems.

Isani wafer treatment minimizes defects on organic and high-stress films and extends process kit life by up to 10X, substantially lowering the cost of consumables compared with traditional inductively coupled plasma sputter chambers. Longer process kit life both lowers production costs and increases output by reducing preventive maintenance frequency to give customers the lowest cost of ownership among packaging deposition systems. Select magnetron and PVD chamber design improvements fulfill exacting film deposition uniformity specifications for various metals used in UBM and RDL applications (e.g., Ti, TiW, Cu, and NiV).

The Charger system's modular architecture enhances configuration flexibility, making it easy to expand a compact three-chamber R&D configuration into a five-chamber, high-volume manufacturing system with minimal downtime.