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| Physical Vapor Deposition (PVD) is mainly a physical, rather than chemical, process. In PVD, atoms of a heavy, but inert gas, typically argon, are electrically accelerated toward a "target" of pure metal. These atoms chip off or "sputter" the target material, atom by atom. The sputtered metal lands on the wafer surface, where it forms a solid layer of metal. This layer might be patterned and etched (aluminum-based interconnects) or followed by bulk metal deposition (copper-based interconnect designs) to form the conducting "wires" in a semiconductor device. |
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