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| In Chemical Vapor Deposition (CVD) a gas containing a metal or insulator chemistry is sprayed on the wafer. These gases react on the heated wafer surface, forming a thin film of solid material. Energy sources such as heat and radio frequency (rf) power are used alone or in combination to achieve this reaction. These CVD films range in thickness from a small fraction of a micron to a few microns and must be deposited with extreme uniformity across the wafer. |
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