SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 7, 2006--Applied
Materials, Inc. will host a technical symposium on December 12, 2006,
in San Francisco with distinguished executives and technologists from
leading chip companies and universities, including AMD, IBM, Intel,
MIT, and TI to discuss the industry's imminent move to 32nm device
manufacturing. The event will provide an in-depth look at the critical
design and process issues that must be resolved to ensure a successful
transition to the 32nm technology node.
Topics:
-- Key bottlenecks in logic and Flash at the 32 nm node
-- Viable 32nm node structures for logic transistor/Flash cells
-- High-k/metal gates
-- New design rules and device parasitics
Panel:
Dr. Zroan Krivokapic, Senior Member of Technical Staff,
Strategic Technology Group, AMD
Dr. Ghavam Shahidi, Fellow, Director of High Performance Logic,
IBM
Dr. Al Fazio, Fellow, Intel
Dr. Judy Hoyt, MIT
Dr. Venu Menon, Vice President, Silicon Technology Development,
TI
Dr. Farhad Moghadam, Senior Vice President, Applied Materials
Moderator, Dr. Scott E. Thompson, University of Florida
When: Tuesday, Dec. 12, 2006
Where: Hotel Nikko
222 Mason St. San Francisco, CA 94102
Agenda:
5:15 to 5:30 pm Registration
5:30 to 6:15 pm Dinner
6:15 to 7:15 pm Panel Discussion
Register at:
http://www.appliedmaterials.com/2006_32nm_symposium/index.html
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in
Nanomanufacturing Technology(TM) solutions with a broad portfolio of
innovative equipment, service and software products for the
fabrication of semiconductor chips, flat panels, solar photovoltaic
cells, flexible electronics and energy efficient glass. At Applied
Materials, we apply Nanomanufacturing Technology to improve the way
people live. Learn more at www.appliedmaterials.com.
CONTACT: Applied Materials, Inc.
Connie Duncan, 408-563-6209 (Technical Media)
Patricia Zepeda, 408-563-8160 (Business Media)
SOURCE: Applied Materials, Inc.