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Developing security standards so that data analysis experts can work together to solve thorny process control challenges remains a top priority as semiconductor manufacturing moves to a smart manufacturing model.
Leading conference on process control solutions for semiconductor and related high precision industries slated for San Antonio, Texas on October 28-31, 2019.
Compared with CMP for 300mm wafers, planarizing 200mm wafers with thick copper layers presented new challenges. Smaller polishing head zone sizes, much thicker bulk copper processes, and wafer edge issues added up to a demanding development process.
Factory automation increasingly depends on our ability to make complex decisions rapidly, but many semiconductor fabrication processes have exceeded the cognitive capabilities of humans to troubleshoot anomalies and assess all relevant variables. Thus, automation has become a key strategy used to address these challenges.
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