skip to main content

nanochip fab solutions

Article Library

Equipment & Materials Engineering

Benchmarking & Productivity

Advanced Process Control & Data Analytics

Automation Software

Energy & Fab Sustainability

Parts & Services

Marketing & Industry Trends

Previous Issues

Previous Issues

In today’s fabs, it has become increasingly difficult and time-consuming to integrate and harmonize the data coming from diverse computer-integrated manufacturing applications. In fact, this is now a major stumbling block to the rapid deployment of these systems and, hence, to the ability of a fab to quickly achieve targeted productivity.
Read more
For close to a decade, the 200mm semiconductor state-of-the-art has been in a constant cycle of re-invention. Today’s leading consumer, medical, communications, industrial and automotive products are driving brisk demand for all kinds of devices.
Read more
See us at our upcoming Applied Global Services Spring Events
Read more
The new International Roadmap for Devices and Systems charts an end-to-end course for the computing ecosystem, including device manufacturing, and captures the trends in "smart" manufacturing for the microelectronics manufacturing industries.
Read more
A series of annual internal technology meetings, Applied’s Engineering and Technology (ET) Conference program, has become an effective way to bring together the company’s engineers from far-flung regions to collaborate on innovative technology concepts and exchange ideas on processes, equipment, and support services.
Read more
There was a period, one that ended five or more years ago, when the semiconductor equipment industry put nearly all of its attention into improving 300mm manufacturing. Then smartphone sales exploded.
Read more
When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.
Read more
Customers need to generate the highest profits as quickly as possible in today’s highly competitive and fast-changing markets.
Read more
Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.
Read more
Fully automated fabs offer significantly better yields, output, cycle times, operating costs and flexibility than partially automated ones.
Read more