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Compared with CMP for 300mm wafers, planarizing 200mm wafers with thick copper layers presented new challenges. Smaller polishing head zone sizes, much thicker bulk copper processes, and wafer edge issues added up to a demanding development process.
Factory automation increasingly depends on our ability to make complex decisions rapidly, but many semiconductor fabrication processes have exceeded the cognitive capabilities of humans to troubleshoot anomalies and assess all relevant variables. Thus, automation has become a key strategy used to address these challenges.
In an industry as demanding as semiconductor manufacturing, where globalization, capital investments, and technical complexity continue to accelerate, the availability of service parts inventory to ensure equipment availability is a critical success factor.