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Previous Issues

Previous Issues

Among the many tenets of smart manufacturing, “digital twin” solutions represent a significant opportunity for microelectronics manufacturers to leverage existing and emerging technologies to improve quality and throughput, and reduce variability and cost.

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Yield enhancement has always been a key goal for semiconductor manufacturers, but has taken on increased urgency given the strong demand for chips to meet a diverse and growing set of applications.

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Consumers are moving to larger and larger televisions, attracted by the chance to have a more immersive experience and the ability to see what is on the screen from farther away.

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As Moore’s Law has been stretched and the industry has become more global, more capital intensive, and more competitive, the focus of fab managers has expanded beyond device- and equipment breakthroughs to include significant advances in service technologies to boost the efficiency of semiconductor fabs.

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Given today’s high market demand for semiconductor products, device manufacturers are looking for ways to maximize the output of good wafers from their fabs−and optimize their returns on invested capital.

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The semiconductor industry has new drivers in automotive, Internet of Things (IoT), both high- and low power, sensors, and medical and industrial applications—which happen to be traditional European core strengths. The new CEO of French RTO Leti and other industry leaders and analysts see this as a golden opportunity.

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To unlock the full potential of their manufacturing systems and personnel, companies in many industries are rapidly moving toward highly automated systems and digital data-driven methods and tools. Widely known as “smart manufacturing” or Industry 4.0, the resulting productivity improvements are often so dramatic that many people are calling this shift a new industrial revolution.

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Did you think chip making on 150mm wafers was a thing of the past? Think again. Many of the megatrends shaping our collective futures— mobility, autonomous driving and electric vehicles, 5G wireless communications, augmented- and virtual reality (AR/VR), and healthcare—depend on innovations created on the 150mm wafer size.

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At SEMI’s ISS conference early this year, Niles predicted that fully autonomous cars— widely viewed as a replacement for conventional automobiles— will begin to hit the roads by 2021, while noting that these self-driving cars “will require a tremendous increase in semiconductor content.”

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Nanochip Express Spring 2018

 The annual Advanced Process Control Conference (APC) is the world’s leading forum for technologists in semiconductor manufacturing and related industries to discuss, debate and display the latest advanced process control trends, ideas, requirements, technical advancements and solutions.

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Nanochip Express Spring 2018
Tech Cycles Can Change Fast. Stay Up to Speed.
Nanochip Express - Fall 2016
Nanochip Express, October 2016
Nanochip Express - Spring 2016
Nanochip Express, April 2016
Nanochip Express - Fall 2015
Nanochip Express, September 2015
Nanochip Express - Spring 2015
Nanochip Express, April 2015
Nanochip Express, September 2014
Nanochip Express, April 2014
Nanochip Fab Solutions Express, September 2013