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nanochip fab solutions

Nanochip Cover
Winter 2016

As we approach the practical, physical limitations of Moore’s Law, some chip makers are exploring new roadmaps to achieve More Moore advanced CMOS technologies or More than Moore non-digital functionality. Regardless of which roadmap you choose, this Nanochip Special Focus Edition offers solutions to help you get MORE of what you need. More automated tools. More process improvements. More throughput and yield. More profits.

Article Library

Equipment & Materials Engineering

Benchmarking & Productivity

Advanced Process Control & Data Analytics

Automation Software

Energy & Fab Sustainability

Parts & Services

Marketing & Industry Trends

Previous Issues

Previous Issues

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There was a period, one that ended five or more years ago, when the semiconductor equipment industry put nearly all of its attention into improving 300mm manufacturing. Then smartphone sales exploded.
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When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.
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Customers need to generate the highest profits as quickly as possible in today’s highly competitive and fast-changing markets.
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Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.
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Fully automated fabs offer significantly better yields, output, cycle times, operating costs and flexibility than partially automated ones.
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Applied has developed a new output improvement service solution for the 200mm Endura system to quickly modernize the equipment, improve process control and increase output by an average of 10%.
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High factory yield and output are the foundation of financial performance in a semiconductor fab, and matched performance across all chambers in a fleet is a key mechanism for enhancing factory performance.
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Chemical mechanical planarization/polishing (CMP) processing is affected by various factors, including consumables, process parameters, and polisher hardware design.
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Factory automation is a key strategy used by many manufacturers to achieve more sustainable manufacturing because of its potential to reduce waste, inventory, unnecessary processing, and idle time. A pilot project at the SanDisk assembly and test facility in Shanghai, China, demonstrates the promise of this approach.
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The ITRS semiconductor roadmap has morphed into the International Roadmap for Devices and Systems (IRDS), with a different, more system - and application-focused purpose than the scaling-oriented ITRS.
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