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Food for Thought

From an alphabet soup of technologies—AI, VR, AR, 5G, and IoT to name a few—to the massive expansion of chip making efforts in China, there’s plenty of industry news to digest these days. NanochipExpress can help with a few timely tidbits you can read on the goon your desktop, laptop or mobile device.

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Previous Issues

Previous Issues

Applied Materials will be prominently represented at two of China’s largest annual semiconductor technology conferences from March 13 – 16, in Shanghai.
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Applied Materials will introduce a redesigned 200mm epi chamber. The new Applied Materials Centura Pronto Atmospheric (ATM) Epi chamber is specifically designed to produce the industry’s highest-quality thick silicon films (20-130µm) needed for power, MEMS and other devices used in fast--growing mobile and Internet of Things (IoT) technologies.
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In today’s fabs, it has become increasingly difficult and time-consuming to integrate and harmonize the data coming from diverse computer-integrated manufacturing applications. In fact, this is now a major stumbling block to the rapid deployment of these systems and, hence, to the ability of a fab to quickly achieve targeted productivity.
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For close to a decade, the 200mm semiconductor state-of-the-art has been in a constant cycle of re-invention. Today’s leading consumer, medical, communications, industrial and automotive products are driving brisk demand for all kinds of devices.
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See us at our upcoming Applied Global Services Spring Events
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The new International Roadmap for Devices and Systems charts an end-to-end course for the computing ecosystem, including device manufacturing, and captures the trends in "smart" manufacturing for the microelectronics manufacturing industries.
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A series of annual internal technology meetings, Applied’s Engineering and Technology (ET) Conference program, has become an effective way to bring together the company’s engineers from far-flung regions to collaborate on innovative technology concepts and exchange ideas on processes, equipment, and support services.
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There was a period, one that ended five or more years ago, when the semiconductor equipment industry put nearly all of its attention into improving 300mm manufacturing. Then smartphone sales exploded.
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When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.
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Customers need to generate the highest profits as quickly as possible in today’s highly competitive and fast-changing markets.
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