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Raider GT Electrochemical Deposition

Electro-chemical deposition (ECD) is a rapid and cost-effective method used to lay down the bulk of the copper wiring in semiconductor device manufacturing. The wiring is used to create the interconnects needed to form the electrical circuits. For the circuit to function properly, it is essential that the metal completely fills the features of this wiring (vias and trenches) without seams or voids, which would jeopardize electrical reliability and functionality.

As feature sizes scale down to less than 20nm and their aspect ratios increase (>5:1), it becomes increasingly difficult to achieve the balance of bottom-up fill and sidewall suppression that produces flawless fill. In addition, thinner seed layers, with increased resistance, and higher device densities make it more difficult to achieve uniform deposition across the wafer to achieve high device yields.

The Raider GT ECD system for copper interconnect gap fill in memory and logic devices features dynamic current-control technology, microsecond recipe control, and the ability to use the widest range of process chemistry (low-to-high bath conductivity). These features are key to its optimal small feature filling capability and deposition uniformity across the wafer. The ability of the system to dynamically and rapidly adjust and control the current density as the wafer enters solution and throughout deposition is the core of the Raider GT technology.

The new system extends the technology of previous Raider systems by enabling sub-20nm small feature fill with the highest productivity and lowest cost of ownership. Uniquely flexible, the Raider GT design allows for a portion of the system to run a second chemistry. Both chemistries can be run simultaneously or the configuration can be changed, with minimal downtime, to allow a single chemical process to be run for maximum productivity.

The Raider GT system is capable of delivering up to a 100% gain in throughput compared to previous Raider systems. Additional cost savings are obtained by employing ionic membranes to extend chemistry life, bulk copper anode materials to minimize cost, and "No-Teach" precision automation to reduce down-time.