March 16, 2017
INFLECTION FOCUSED INNOVATION
Please join us for a day-long program exploring the technical advances driven by continued scaling, 3D device architectures, and the development of diverse packaging schemes.
Presentations will offer an overview of Applied’s product portfolio and highlight a wide range of technologies, including wafer-level packaging solutions, recent developments in unit processes relevant to memory and logic, and next-generation defect inspection technology.
We look forward to seeing you there!