Anyone who’s anyone in the Micro-Electro-Mechanical Systems (MEMS) community descended upon Zurich in Switzerland earlier this month for the first ever European MEMS Executive Congress.

As memory scaling proceeds, the industry is evaluating a variety of options for achieving the performance required from sub-2X memory devices.

DRAM, Flash, and emerging memory development each face unique complexities and unknowns. What will DRAM technology look like in three to five years? What is the next big growth area for the NAND market? What’s next in emerging memory? Is a universal memory format the next technology?

The industry has reached a crucial inflection point on the adoption and commercialization of 3D packaging technology, and Applied Materials’ CTO Hans Stork gave attendees of the 3D Architectures for Semiconductor Integration and Packaging conference held recently in Burlingame, Calif. his assessment on the current status of this emerging technology.