The Micro-Electro-Mechanical Systems (MEMS) – Executive Congress is now in its seventh year and with over 200 people in planned attendance, this years’ gathering is promising to be the largest in the history of the event. Organized by the MEMS Industry Group (MIG), executive congress is focused on drawing together executives from across the MEMS supply chain to meet and discuss topics ranging from end-user applications to new technologies and current go-to-market strategies for MEMS.
딥 실리콘 에치 기술은 3D 장치 부품 제조 과정에서 매우 중요한 기술입니다. 고전력 플라즈마는 웨이퍼 표면을 부식시키는 데 사용되며 이를 통해 원하는 구조를 제조할 수 있습니다.
While there are numerous applications of dry etch processes in MEMS, the deep silicon etch requirements of freely movable, capacitively coupled MEMS such as those used for inertial measurement, pose the greatest process challenges. Accurate and repeatable profile control across the wafer, fast etch rate and high device yield are principal requirements for today’s critical MEMS etch processes.